Computer system and composite heat dissipation system

• Main Authors: TONG KAIYANG, CHEN HONGRU
• Format: Patent
• Language: Chinese; English
• Published: 18.05.2021
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention provides a computer system which is used for being connected with an external heat dissipation device and comprises a shell, a circuit board, a heat source, an open type heat dissipation device and a closed type heat dissipation device. The circuit board is arranged on the shell. The heat source is arranged on the circuit board. The open type heat dissipation device comprises a liquid cooling plate and two fluid connectors. The liquid cooling plate is arranged on the circuit board and keeps a distance from the heat source. The liquid cooling plate is used for being connected to an external heat dissipation device through the two fluid connectors. The closed heat dissipation device comprises an evaporator and a condenser which are connected with each other. The evaporator thermally contacts the heat source. The condenser is in thermal contact with the liquid cooling plate. 本发明提供一种计算机系统，用以连接外部的散热装置，且包含壳体、电路板、热源、开放式散热装置以及封闭式散热装置。电路板配置于壳体。热源设置于电路板。开放式散热装置包含液冷板及两个流体接头。液冷板设置于电路板并与热源保持一距离。液冷板用以通过两个流体接头