Polyimide covering film laser cutting decarbonizing device and decarbonizing method

• Main Authors: HUANG LIUQING, LIU WENXIN, LYU FENGYANG, ZHAO SHIZHONG, LUO XUETAO, CHEN ZHICHENG
• Format: Patent
• Language: Chinese; English
• Published: 18.05.2021
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The invention provides a polyimide cover film laser cutting decarbonizing device and decarbonizing method. The polyimide cover film laser cutting decarbonizing device comprises a laser cutting device and further comprises a refrigerating device, a cover film fixing device and a dry ice cleaning device; the laser cutting device, the refrigerating device and the covering film fixing device are sequentially connected through a conveying belt; the cover film fixing device is provided with a cover film fixing platform; and the dry ice cleaning device comprises a dry ice spray gun, and a spray head of the dry ice spray gun is aligned with the plane of the covering film fixing platform. The device can effectively remove the carbonized layer on the surface of a polyimide cover film. 本发明提供了一种聚酰亚胺覆盖膜激光切割除碳装置及除碳方法，该聚酰亚胺覆盖膜激光切割除碳装置包括激光切割装置，还包括制冷装置、覆盖膜固定装置及干冰清洗装置；所述激光切割装置、所述制冷装置及覆盖膜固定装置通过传送带依次连接；所述覆盖膜固定装置设置有覆盖膜固定平台；所述干冰清洗装置包括干冰喷喷枪，所述干冰喷枪的喷头对准所述覆盖膜固定平台的平面。该装置能有效去除聚酰亚胺覆盖膜表面的碳化层。