PRINTED CIRCUIT BOARD SUBSTRATE COMPRISING A COATED BORON NITRIDE

• Main Authors: KIM EUI-KYOON, BROWN CHRISTOPHER, FITTS BRUCE
• Format: Patent
• Language: Chinese; English
• Published: 14.05.2021
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

In an embodiment, a printed circuit board substrate (12) comprises a polymer matrix; a reinforcing layer (42); and a plurality of coated boron nitride particles (44); wherein the plurality of coated boron nitride particles comprise a coating having an average coating thickness of 1 to 100 nanometers...