PRINTED CIRCUIT BOARD SUBSTRATE COMPRISING A COATED BORON NITRIDE

• Main Authors: KIM EUI-KYOON, BROWN CHRISTOPHER, FITTS BRUCE
• Format: Patent
• Language: Chinese; English
• Published: 14.05.2021
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

In an embodiment, a printed circuit board substrate (12) comprises a polymer matrix; a reinforcing layer (42); and a plurality of coated boron nitride particles (44); wherein the plurality of coated boron nitride particles comprise a coating having an average coating thickness of 1 to 100 nanometers. The polymer matrix can comprise at least one of an epoxy, a polyphenylene ether, polystyrene, an ethylene-propylene dicyclopentadiene copolymer, a polybutadiene, a polyisoprene, a fluoropolymer, or a crosslinked matrix comprising at least one of triallyl cyanurate, triallyl isocyanurate, 1,2,4-trivinyl cyclohexane, trimethylolpropane triacrylate, or trimethylolpropane trimethacrylate. 在一个实施方案中，印刷电路板基板(12)包括聚合物基体；增强层(42)；和多个经涂覆的氮化硼颗粒(44)；其中所述多个经涂覆的氮化硼颗粒包含平均涂覆厚度为1纳米至100纳米的涂层。所述聚合物基体可以包含环氧树脂、聚苯醚、聚苯乙烯、乙烯-丙烯二环戊二烯共聚物、聚丁二烯、聚异戊二烯、含氟聚合物、或者交联基体中的至少一者，所述交联基体包含氰脲酸三烯丙酯、异氰脲酸三烯丙酯、1,2,4-三乙烯基环己烷、三羟甲基丙烷三丙烯酸酯、或者三羟甲基丙烷三甲基丙烯酸酯中的至少一者。