Circuit board with embedded heat dissipation material and manufacturing method thereof

• Main Authors: LIN MENGRONG, ZHOU ZHIYANG, HU ZHAOXIA, DONG XIANGLING
• Format: Patent
• Language: Chinese; English
• Published: 14.05.2021
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention discloses a method for manufacturing a circuit board with an embedded heat dissipation material, and the method comprises the following steps: selecting resin, adding a filler into a resin system, and preparing a glue solution; selecting a heat dissipation material, and generating a glue layer on the side surface of the heat dissipation material; carrying out baking treatment on the heat dissipation material with the glue layer on the side surface to enable the adhesive layer to be in a semi-curing stage; and embedding the heat dissipation material with the semi-cured adhesive layer into the insulating substrate, and pressing to manufacture the circuit board. According to the method provided by the invention, the glue flowing defect can be improved to a great extent, and the condition of insufficient glue filling is avoided; by adding and blending the filler, the heat-conducting property of the adhesive layer is optimized, the temperature gradient of the interface of the heat-dissipating materia