LED chip and manufacturing method thereof

• Main Authors: XIA ZHANGGEN, LIN SUHUI, HE ANHE, NIE ENSONG, WANG FENG, PENG KANGWEI
• Format: Patent
• Language: Chinese; English
• Published: 11.05.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention relates to an LED chip and a manufacturing method thereof, and discloses an LED chip, which comprises a transparent substrate, the substrate is provided with a front surface and a back surface which are opposite to each other, the front surface of the substrate is provided with an LED unit, the substrate is provided with a coarsening layer parallel to the front surface, and the coarsening layer is a metamorphic layer formed by laser burning. The invention further discloses a method for coarsening the light-emitting surface of the LED chip, the metamorphic layer is formed in the substrate through laser burning, laser burning traces on the metamorphic layer serve as a coarsening structure of the coarsening layer, and the problem that the efficiency of an existing method for achieving coarsening of the light-emitting surface through wet-method or dry-method etching is low is solved. 本发明涉及一种LED芯片及制作方法，本发明公开了一种LED芯片，包括透明的衬底，该衬底具有相对的正面和背面，该衬底的正面上具有LED单元，衬底上具有与正面平行设置的粗化层，该粗化层是由激光烧灼而形成的变质层。本发明还公开一种LED芯片