Microfluid adapter plate integrated with high-power radio frequency chip and preparation method of microfluid adapter plate
The invention provides a microfluid adapter plate integrated with a high-power radio frequency chip and a preparation method of the microfluid adapter plate. The microfluid adapter plate comprises a signal interconnection layer, a micro-channel structure layer and a microfluid interface structure la...
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Main Authors | , , , , |
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Format | Patent |
Language | Chinese English |
Published |
07.05.2021
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Subjects | |
Online Access | Get full text |
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Summary: | The invention provides a microfluid adapter plate integrated with a high-power radio frequency chip and a preparation method of the microfluid adapter plate. The microfluid adapter plate comprises a signal interconnection layer, a micro-channel structure layer and a microfluid interface structure layer, wherein the signal interconnection layer comprises a top silicon wafer and a thick copper structural member, the surface of the top silicon wafer is covered with a grounding metal layer, the thick copper structural member is embedded into the top silicon wafer, and the upper surface of the thick copper structural member is provided with a chip bonding surface and is connected with the grounding metal layer; the micro-channel structure layer comprises a middle-layer silicon wafer as well as a shunting channel and a converging channel which are arranged in the middle-layer silicon wafer, a plurality of cooling channels are arranged between the shunting channel and the converging channel in parallel, and the shun |
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Bibliography: | Application Number: CN202011621897 |