Microfluid adapter plate integrated with high-power radio frequency chip and preparation method of microfluid adapter plate

• Main Authors: SHI GUIXIONG, ZHU JIAN, YU MIAO, ZHANG HONGZE, HUANG MIN
• Format: Patent
• Language: Chinese; English
• Published: 07.05.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES; MICROSTRUCTURAL TECHNOLOGY; PERFORMING OPERATIONS; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS; SEMICONDUCTOR DEVICES; TRANSPORTING

The invention provides a microfluid adapter plate integrated with a high-power radio frequency chip and a preparation method of the microfluid adapter plate. The microfluid adapter plate comprises a signal interconnection layer, a micro-channel structure layer and a microfluid interface structure layer, wherein the signal interconnection layer comprises a top silicon wafer and a thick copper structural member, the surface of the top silicon wafer is covered with a grounding metal layer, the thick copper structural member is embedded into the top silicon wafer, and the upper surface of the thick copper structural member is provided with a chip bonding surface and is connected with the grounding metal layer; the micro-channel structure layer comprises a middle-layer silicon wafer as well as a shunting channel and a converging channel which are arranged in the middle-layer silicon wafer, a plurality of cooling channels are arranged between the shunting channel and the converging channel in parallel, and the shun