Packaging method of high-power MOS tube

The invention relates to a packaging method of a high-power MOS tube, which is characterized in that a heat dissipation layer is additionally arranged at the top of the MOS tube, so that the heat dissipation effect is improved; the heat dissipation layer is linked with a source electrode leading-out...

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Bibliographic Details
Main Author HUANG DALI
Format Patent
LanguageChinese
English
Published 04.05.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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