Semiconductor relay module and semiconductor relay circuit

The present disclosure provides a semiconductor relay module that ensures stable operation characteristics and facilitate circuit board design. The first input circuit and the second input circuit are connected to the first input terminal and the second input terminal within the package. A third inp...

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Bibliographic Details
Main Authors OKADA SHIGENARI, SASAKI SHINYA, AKUTAGAWA TOSHINOBU
Format Patent
LanguageChinese
English
Published 04.05.2021
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Summary:The present disclosure provides a semiconductor relay module that ensures stable operation characteristics and facilitate circuit board design. The first input circuit and the second input circuit are connected to the first input terminal and the second input terminal within the package. A third input circuit is connected to the first input terminal and the third input terminal or to the second input terminal and the third input terminal in a package. The first output circuit is connected to the first output terminal and the first connection line within the package. The second output circuit is connected to the second output terminal and the first connection line within the package. The third output circuit is connected to the third output terminal and the first connection line within the package. The first monitoring terminal is connected to the first connection line within the package. A portion of the first monitoring terminal is disposed so as to be exposed to the outside of the package. 本发明提供一种半导体继电器模块,其
Bibliography:Application Number: CN202011020906