Touch module installation structure, electronic equipment and disassembly and assembly method

• Main Authors: HU SHIJUN, LEI XIANYOU
• Format: Patent
• Language: Chinese; English
• Published: 30.04.2021
• Subjects: CALCULATING; COMPUTING; COUNTING; ELECTRIC DIGITAL DATA PROCESSING; PHYSICS

The invention relates to the technical field of electronic equipment, and particularly discloses a touch module mounting structure, electronic equipment and a disassembly and assembly method. The touch module mounting structure comprises a touch module, a magnetic assembly and a fixing part, and the touch module is detachably connected with the fixing part through the magnetic assembly; the magnetic assembly includes a magnet and a coil. According to the touch module installation structure, the electronic equipment and the disassembly and assembly method, the assembly and disassembly process of the touch module is simple and rapid, and other parts are not prone to being damaged. 本发明涉及电子设备技术领域，具体公开一种触控模组安装结构、电子设备及拆装方法，所述触控模组安装结构包括触控模组、磁性组件和固定部件，所述触控模组通过所述磁性组件与所述固定部件可拆卸连接；所述磁性组件包括磁体和线圈。本发明提供一种触控模组安装结构、电子设备及拆装方法，触控模组的装拆过程简单快捷，且不易对其它零部件造成损伤。