Image joint elimination method and device and electronic equipment
The invention provides an image seam elimination method and device and electronic equipment, and the method comprises the steps: carrying out non-uniformity correction of an image obtained by an infrared focal plane detector, and obtaining a corrected image; wherein a focal plane of the infrared foc...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
23.04.2021
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Subjects | |
Online Access | Get full text |
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Summary: | The invention provides an image seam elimination method and device and electronic equipment, and the method comprises the steps: carrying out non-uniformity correction of an image obtained by an infrared focal plane detector, and obtaining a corrected image; wherein a focal plane of the infrared focal plane detector comprises at least two parts, the at least two parts are spliced into the focal plane, and each part is driven by an independent circuit; for any seam in the corrected image, extracting a difference value of pixels on two sides of the seam in the corrected image; wherein the seam corresponds to the splicing position of two adjacent parts in the at least two parts of the focal plane; and eliminating the joint according to the difference value. The joint elimination of the infrared image of the infrared splicing detector can be realized.
本申请提供一种图像接缝消除方法、装置及电子设备,该方法包括:对红外焦平面探测器获取的图像进行非均匀性校正,得到校正后的图像;所述红外焦平面探测器的焦平面包括至少两个部分,所述至少两个部分拼接成所述焦平面,各部分采用独立的电路进行驱动;对于所述校正后的图像中的任一接缝,提取所述校正后的图像中该接缝两侧的像素的差异值;所述接缝与所 |
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Bibliography: | Application Number: CN202011540592 |