Wafer cleaning system
The invention discloses a wafer cleaning system, and the system comprises a feeding control module, a discharging control module, a manipulator control module, a lower computer, a feeding module, a discharging module, a process tank module and a manipulator conveying module. The feeding control modu...
Saved in:
Main Author | |
---|---|
Format | Patent |
Language | Chinese English |
Published |
16.04.2021
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | The invention discloses a wafer cleaning system, and the system comprises a feeding control module, a discharging control module, a manipulator control module, a lower computer, a feeding module, a discharging module, a process tank module and a manipulator conveying module. The feeding control module, the discharging control module and the manipulator control module are all in control connection with the lower computer; the feeding module is in control connection with the feeding control module and used for conveying the wafer bearing device to the feeding conveying position from the feeding position; the discharging module is in control connection with the discharging control module and used for conveying the wafer bearing device from the discharging conveying position to the discharging position; the process tank module is located between the feeding module and the discharging module; and the manipulator conveying module is in control connection with the manipulator control module and is used for conveying |
---|---|
Bibliography: | Application Number: CN202011553797 |