Integrated semiconductor wafer cleaning machine and cleaning method

• Main Authors: WANG WENJIE, LIU LINTAO, WEI HAO, MO SHANGJUN, WU CHUNFENG, ZHAO TIANYUAN
• Format: Patent
• Language: Chinese; English
• Published: 16.04.2021
• Subjects: BLASTING; CLEANING; CLEANING IN GENERAL; DRYING; DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM; HEATING; LIGHTING; MECHANICAL ENGINEERING; PERFORMING OPERATIONS; PREVENTION OF FOULING IN GENERAL; TRANSPORTING; WEAPONS

The invention discloses an integrated semiconductor wafer cleaning machine and a cleaning method. The cleaning method comprises the following steps: S1, when a cleaning machine body starts to work, a main power supply is powered on and a motor of an exhaust fan is started, the exhaust fan is in a working state all the time in a wafer cleaning process, the exhaust fan rotates for exhausting air, and water mist in a cleaning cavity in a cleaning machine body is exhausted; and S2, in the working process of the cleaning machine body, the temperature in a cleaning chamber is constant, and when condensate water and condensed water are generated in an exhaust pipe in the step S1, the condensate water and the condensed water flow from the interior of the cleaning machine body to the exterior of the cleaning machine body through a one-way valve, water flowing back to the inner side from the outer side cannot pass through the one-way valve, and the condensate water cannot flow back. The cleaning method can effectively