PARTITIONED SUBSTRATES WITH INTERCONNECT BRIDGE

• Main Authors: TREMBLE ERIC W, KUEMERLE MARK W, SAUTER WOLFGANG
• Format: Patent
• Language: Chinese; English
• Published: 13.04.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The present disclosure relates to semiconductor structures and, more particularly, to partitioned substrates with interconnect bridge structures and methods of manufacture. The structure includes: a plurality of substrates; at least one chip bonded and electrically connected to each of the plurality of substrates; and an interconnect bridge that physically connects the plurality of substrates and electrically connects each of the plurality of chips bonded to each of the plurality of substrates. 本公开涉及半导体结构，并且更具体地涉及具有互连桥接结构的分隔基板及制造方法。一种结构，包括：多个基板；至少一个芯片，该至少一个芯片被接合且电连接到多个基板中的每个基板；以及互连桥接，互连桥接，物理地连接多个基板，并且电连接与多个基板中的每一个基板接合的多个芯片中的每个芯片。