Wafer, wafer scribing method and core particle

• Main Authors: WANG DUXIANG, GAO JIA, TANG GUOLIANG, ZHANG DONGYAN, SONG DI, JIN CHAO
• Format: Patent
• Language: Chinese; English
• Published: 06.04.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The invention provides a wafer, a wafer scribing method and a core particle. In the scribing process, by adjusting the angle of a reflector in a scribing device, an included angle is formed between a laser beam and the third direction perpendicular to a wafer substrate, so that the laser beam obliquely irradiates to a cutting way formed in the surface of the wafer from the third direction, in four side walls of the periphery of the core particle generated due to scribing, the heights of the two adjacent side walls are the same, the heights of the two opposite side walls are different, in the subsequent sorting and die bonding stages, when a suction nozzle is used for placing the core particle in a specific area, the difficulty of releasing the suction nozzle is lowered, and the problem that the core particle adheres to the suction nozzle is solved. Moreover, the difficulty of releasing the suction nozzle in the subsequent sorting and die bonding stages can be reduced only by finely adjusting the angle of the