SYSTEM FOR PREDICTING PROPERTIES OF STRUCTURES, IMAGER SYSTEM, AND RELATED METHODS

• Main Authors: LYONSMITH SHAWN D, TAYLOR TED L, HALLER GORDON A, NOEMAUN AHMED N, RAMACHANDRAN PRADEEP, LIU QIANLAN, MCCANDLESS STEVE K, MAJUMDAR AMITAVA
• Format: Patent
• Language: Chinese; English
• Published: 19.03.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CALCULATING; COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS; COMPUTING; COUNTING; ELECTRIC DIGITAL DATA PROCESSING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; IMAGE DATA PROCESSING OR GENERATION, IN GENERAL; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; PHYSICS; SEMICONDUCTOR DEVICES; TESTING

A method of predicting virtual metrology data for a wafer lot that includes receiving first image data from an imager system, the first image data relating to at least one first wafer lot, receiving measured metrology data from metrology equipment relating to the at least one first wafer lot, applying one or more machine learning techniques to the first image data and the measured metrology data to generate at least one predictive model for predicting at least one of virtual metrology data or virtual cell metrics data of wafer lots, and utilizing the at least one generated predictive model togenerate at least one of first virtual metrology data or first virtual cell metrics data for the first wafer lot. 一种预测晶片批次的虚拟计量数据的方法包含：从成像器系统接收第一图像数据，所述第一图像数据与至少一个第一晶片批次有关；从计量设备接收与所述至少一个第一晶片批次有关的所测量计量数据；向所述第一图像数据和所述所测量计量数据应用一或多个机器学习技术以产生至少一个用于预测晶片批次的虚拟计量数据或虚拟单元度量数据中的至少一个的预测性模型；以及利用所述至少一个产生的预测性模型产生所述第一晶片批次的第一虚拟计量数据或第一虚拟单元度量数据中的至少一个。