Method of forming package structure

• Main Authors: HUANG SONGHUI, HOU SHANGYONG, HUANG GUANYU
• Format: Patent
• Language: Chinese; English
• Published: 16.03.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A method for forming the package structure is provided. The method includes forming a die structure over a first surface of a first substrate, and forming a plurality of electrical connectors below asecond surface of the first substrate. The method also includes forming a first protruding structure below the second surface of the first substrate, and the electrical connectors are surrounded by the first protruding structure. The method further includes forming a second protruding structure over a second substrate, and bonding the first substrate to the second substrate. The electrical connectors are surrounded by the second protruding structure, and the first protruding structure does not overlap with the second protruding structure. 提供一种形成封装结构的方法。方法包括在第一基板的第一表面上方形成晶粒结构，以及在第一基板的第二表面下方形成多个电连接器。方法也包括在第一基板的第二表面下方形成第一突出结构，并且电连接器被第一突出结构围绕。方法还包括在第二基板上方形成第二突出结构，以及将第一基板接合至第二基板。电连接器被第二突出结构围绕，并且第一突出结构不与第二突出结构重叠。