METHOD, SYSTEM AND COMPUTER PROGRAM PRODUCT FOR 3D-NAND CDSEM METROLOGY

• Main Authors: MEIR ROI, LEVIN SAHAR, LEVI SHIMON, MIROKU HIROSHI, YOSHIZAWA TAKU, KLEBANOV GRIGORY, SAHA KASTURI, SCHWARZBAND ISHAI, NOIFELD EFRAT, DUVDEVANI-BAR SHARON, KRIS ROMAN, VERESCHAGIN VADIM
• Format: Patent
• Language: Chinese; English
• Published: 09.03.2021
• Subjects: CALCULATING; COMPUTING; COUNTING; IMAGE DATA PROCESSING OR GENERATION, IN GENERAL; MEASURING; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS; PHYSICS; TESTING

A method for process control of a semiconductor structure fabricated by a series of fabrication steps, the method comprising obtaining an image of the semiconductor structure indicative of at least two individual fabrication steps; wherein the image is generated by scanning the semiconductor structure with a charged particle beam and collecting signals emanating from the semiconductor structure; and processing, by a hardware processor, the image to determining a parameter of the semiconductor structure, wherein processing includes measuring step/s from among the fabrication steps as an individual feature. 一种用于通过一系列制造步骤制造的半导体结构的工艺控制的方法，所述方法包括获得指示至少两个单独制造步骤的半导体结构的图像；其中通过用带电粒子束扫描半导体结构并且收集从半导体结构发出的信号来生成所述图像；以及通过硬件处理器处理图像以确定半导体结构的参数，其中处理包括测量来自制造步骤当中作为单独特征的(多个)台阶。