DETECTION OF ELECTRIC ARC HAZARD RELATED TO WAFER

• Main Authors: BASSON YOSEF, NACKASH SAMUEL IVES, LEVY ITTAMAR
• Format: Patent
• Language: Chinese; English
• Published: 05.03.2021
• Subjects: MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; PHYSICS; TESTING

A method, a non-transitory computer readable medium and a detection system for detecting an electric arc hazard related to a wafer. The detection system may include a measurement unit, an electrode and a processing unit. The measurement unit may be configured to provide a measurement result by measuring an electrical parameter of the electrode during a test period, while the wafer may be moved inrelation to the electrode, and while a certain electrical field may be formed between the electrode and the wafer, wherein the certain electrical field induces detached ends of partially detached conductive elements of the wafer to move away from the wafer. The processing unit may be configured to determine an existence of the electric arc hazard based on the measurement result. 一种用于检测与晶片有关的电弧危害的方法、非暂态计算机可读介质和检测系统。所述检测系统可包括测量单元、电极和处理单元。所述测量单元可被配置为当所述晶片可相对于所述电极移动时，以及当特定电场可形成在所述电极与所述晶片之间时，通过在测试时段期间测量所述电极的电参数来提供测量结果；其中所述特定电场引发所述晶片的部分地分离的导电元件的分离端部移动远离所述晶片。所述处理单元可被配置为基于所述测量结果来确定所述电弧危害的存在。