Punching method for multilayer board with double-sided circuits based on layer deviation detection and punching machine

• Main Authors: CHEN RUNHUI, HUO JINCHONG
• Format: Patent
• Language: Chinese; English
• Published: 05.03.2021
• Subjects: CUTTING; CUTTING-OUT; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING,CUTTING-OUT, STAMPING-OUT OR SEVERING; HAND CUTTING TOOLS; MEASURING; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS; PERFORATING; PERFORMING OPERATIONS; PHYSICS; PUNCHING; SEVERING; SEVERING BY MEANS OTHER THAN CUTTING; STAMPING-OUT; TESTING; TRANSPORTING

The invention relates to the technical field of machining of a multilayer board with a double-sided circuit, in particular to a punching method for the multilayer board with the double-sided circuit based on layer deviation detection and a punching machine applying the punching method. The method comprises the following steps of establishing a coordinate system and a reference circuit board punching mounting position, wherein the reference circuit board punching mounting position is provided with a reference board center and a reference deflection angle; feeding the multilayer board with the double-sided circuit into a circuit board punching mounting position; according to each board surface target of a first surface and each board surface target of a second surface of the multilayer board, obtaining a board surface center and a deflection angle of the multilayer board; and comparing the board surface center and the deflection angle of the multilayer board with the reference board surface center and the refer