Amorphous Layers for Reducing Copper Diffusion and Method Forming Same
A method includes depositing an etch stop layer over a first conductive feature, performing a first treatment to amorphize the etch stop layer, depositing a dielectric layer over the n etch stop layer, etching the dielectric layer to form an opening, etching-through the etch stop layer to extend the...
Saved in:
Main Authors | , , , |
---|---|
Format | Patent |
Language | Chinese English |
Published |
02.03.2021
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Be the first to leave a comment!