Amorphous Layers for Reducing Copper Diffusion and Method Forming Same

• Main Authors: LIU DINGYI, XU KAIXIANG, WU JIAYU, LIN ZHINAN
• Format: Patent
• Language: Chinese; English
• Published: 02.03.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A method includes depositing an etch stop layer over a first conductive feature, performing a first treatment to amorphize the etch stop layer, depositing a dielectric layer over the n etch stop layer, etching the dielectric layer to form an opening, etching-through the etch stop layer to extend the...