Supporting device and fixing method for wafer splinters

• Main Authors: YU PEIPEI, ZHOU SHAN, WANG LIYA, DONG WEICHUN
• Format: Patent
• Language: Chinese; English
• Published: 02.03.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides a supporting device for wafer splinters. The supporting device comprises: a base, wherein the base comprises an inclined surface; and a supporting platform which is located on the inclined plane. The supporting platform comprises: a supporting seat; a plurality of lifting platforms which are arranged on the supporting seat, and are used for placing the wafer splinters; the plurality of side plates are respectively arranged on the side edges of the plurality of lifting platforms; and a movable rod movably connected with the plurality of side plates, wherein the movable rod comprises a plurality of clamping pieces, and clamping or loosening of the wafer splinters between the clamping pieces and the side plates is realized by moving the movable rod. By means of the supporting device, the working efficiency can be improved, the working time can be saved, and the invention further provides a fixing method of the wafer splinters. 本发明提出一种晶圆裂片的支撑装置，该支撑装置包括：底座，所述底座包括一斜面；支撑平台，所述支撑平台位于所述斜面上，其中，所述支