METHOD FOR MANUFACTURING SHIELDED PRINTED WIRING BOARD AND SHIELDED PRINTED WIRING BOARD

• Main Authors: TAJIMA HIROSHI, YAMAUCHI SHIRO, HARUNA YUSUKE, KATSUKI TAKAHIKO
• Format: Patent
• Language: Chinese; English
• Published: 02.02.2021
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

This manufacturing method for shielded printed wiring boards is characterized by including: a step in which a printed wiring board is prepared; a step in which first and second electromagnetic wave shielding films are prepared that have a protective film, an insulating layer, and an adhesive layer positioned in order; a step in which the first and second electromagnetic wave shielding films are arranged on the printed wiring board such that the adhesive layer is in contact with both surfaces of the printed wiring board, then part of the adhesive layer is positioned further on the outside thanan end of the printed wiring board and first and second extended ends are created; a step in which the first extended end and the second extended end are overlapped such that a gap is created in a section between the first extended end and the second extended end, the printed wiring board is pressurized and heated so that the adhesive layer does not completely cure, and a temporarily pressed shielded printed wiring board