Carrier element for semiconductor chip for installing in chip cards

A carrier element for a semiconductor chip and in particular for incorporation into smart cards. The carrier element has an encapsulation composition protecting the semiconductor chip. The carrier element connections are disposed on one of the main surfaces of the encapsulation composition along onl...

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Bibliographic Details
Main Authors J. HEITZER, J. FISCHER, F. PUCHNER
Format Patent
LanguageEnglish
Published 01.10.2003
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HANDLING RECORD CARRIERS
PHYSICS
PRESENTATION OF DATA
RECOGNITION OF DATA
RECORD CARRIERS
SEMICONDUCTOR DEVICES
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Summary:A carrier element for a semiconductor chip and in particular for incorporation into smart cards. The carrier element has an encapsulation composition protecting the semiconductor chip. The carrier element connections are disposed on one of the main surfaces of the encapsulation composition along only two opposite edges. They are made of a conductive material and have a reduced thickness at the ends facing one another, the cross section having a step only on one side. The semiconductor chip is disposed on the connections in a region of the section of reduced thickness and is mechanically connected to the connections.
Bibliography:Application Number: CN19988002532