Stress-free bonding method of zinc sulfide material dual-band spectroscope
The invention provides a stress-free bonding method of a zinc sulfide material dual-band spectroscope. The method comprises the following steps: S1, grinding a mounting surface of a spectroscope frame; S2, measuring the flatness of the mounting surface of the ground spectroscope frame; S3, grinding...
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Main Authors | , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
29.01.2021
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Subjects | |
Online Access | Get full text |
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Summary: | The invention provides a stress-free bonding method of a zinc sulfide material dual-band spectroscope. The method comprises the following steps: S1, grinding a mounting surface of a spectroscope frame; S2, measuring the flatness of the mounting surface of the ground spectroscope frame; S3, grinding a pressing plate mounting surface of the spectroscope frame; S4, placing the spectroscope in the center of a spectroscope frame, and injecting an adhesive into a gap; S5, conducting standing and curing until the adhesive is cured; S6, mounting a pressing plate on the pressing plate mounting surfaceof the spectroscope frame, reserving a bonding gap between the pressing plate and the spectroscope, and injecting an adhesive into the bonding gap; and S7, conducting standing and curing until the adhesive is cured. According to the stress-free bonding method for the zinc sulfide material dual-band spectroscope, through grinding and segmented bonding, the bonding and fixing method for zinc sulfideand plane mirrors which a |
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Bibliography: | Application Number: CN202011182774 |