Semiconductor package and fabrication method thereof

• Main Authors: CAI HUIYAN, DONG YUEMING, LIN YOUZHEN, YANG JIAMING, SU PEIRONG
• Format: Patent
• Language: Chinese; English
• Published: 19.01.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A semiconductor package includes: a first substrate; a first chip arranged on the first surface of the first substrate; a plurality of first electrical contacts arranged on the second surface of the first substrate and electrically connected with the first chip; a first sealing colloid formed on the...