Semiconductor package and fabrication method thereof

• Main Authors: CAI HUIYAN, DONG YUEMING, LIN YOUZHEN, YANG JIAMING, SU PEIRONG
• Format: Patent
• Language: Chinese; English
• Published: 19.01.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A semiconductor package includes: a first substrate; a first chip arranged on the first surface of the first substrate; a plurality of first electrical contacts arranged on the second surface of the first substrate and electrically connected with the first chip; a first sealing colloid formed on the first surface of the first substrate and wrapping the first chip; a second substrate; a second chipand a third chip arranged on the first surface of the second substrate; a plurality of second electrical contacts whiich are arranged on the second surface of the second substrate and are electrically connected with the second chip and the third chip; a second sealing colloid which is formed on the first surface of the second substrate and wraps the second chip and the third chip; an adhesive layer which is arranged between the first sealing adhesive body and the second sealing adhesive body so as to adhere the first sealing adhesive body to the second sealing adhesive body. 一种半导体封装件，包括：一第一基板；一第一芯片，设置在所述第一基板的第一表面；多个第