Embedded diamond silicon-based microfluid heat dissipation adapter plate and preparation method thereof

• Main Authors: WU JING, ZHU JIAN, YU MIAO, ZHANG HONGZE, HUANG MIN
• Format: Patent
• Language: Chinese; English
• Published: 15.01.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses an embedded diamond silicon-based microfluid heat dissipation adapter plate and a preparation method thereof. The adapter plate is composed of an embedded diamond sheet and a silicon-based microfluid heat dissipation structure, wherein a high-power density chip is integrated on the embedded diamond sheet, and the microfluid structure is connected with the embedded diamond sheet through an external circulation system or an integrated micropump; coolant circulation is driven/ According to the adapter plate, high heat flow density at a local hot spot on a chip is rapidly spread in the diamond sheet and rapidly conducted to the position below the embedded diamond sheet by utilizing the high heat conduction characteristic of diamond, the rapid temperature equalization effect of the local hot spot is achieved, and heat exchange with the outside is formed through the convection effect of cooling liquid in the microfluid channel; an efficient circulation heat dissipation process is formed, the