LTCC-based SiP packaging shell and preparation method thereof

• Main Authors: WANG WEI, LIU JUNYONG, LI JINGWEI, ZHOU BO, WU JIANLI, LIU HUI, WU SHENLI
• Format: Patent
• Language: Chinese; English
• Published: 12.01.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses an LTCC-based SiP packaging shell and a preparation method thereof. The SiP packaging shell comprises an LTCC substrate, a metal enclosure frame fixed to the top of the LTCC substrate and a metal cover plate fixed to the top of the metal enclosure frame. The LTCC substrate comprises a ceramic substrate and composite metal wiring layers symmetrically and fixedly arranged atthe top and the bottom of the ceramic substrate. Thick-film silver conductor wires are arranged in the ceramic substrate and on the surface layer of the ceramic substrate, and the composite metal wiring layers sequentially comprise a nickel film layer, a palladium film layer and a gold film layer from inside to outside. The thick-film silver conductor wire on the surface layer of the ceramic substrate is used as an adhesion layer and a brazed stress buffer layer, the nickel film layer is used as a brazed corrosion-resistant layer, and the gold film layer is used as a solderable layer and a protective layer for prevent