Methods and systems for inspecting wafers and reticles using designer intent data

• Main Authors: MARELLA PAUL FRANK, WATSON STERLING, KEKARE SAGAR A, HESS CARL, CHANG ELLIS, VOLK WILLIAM, MCCAULEY SHARON, WILEY JAMES
• Format: Patent
• Language: Chinese; English
• Published: 25.12.2020
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CALCULATING; CINEMATOGRAPHY; COMPUTING; COUNTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; IMAGE DATA PROCESSING OR GENERATION, IN GENERAL; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MATERIALS THEREFOR; MEASURING; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES; TESTING

The invention relates to a method and system for inspecting wafers and reticles using designer intent data. A computer-implemented method includes identifying interference defects on a wafer based oninspection data generated by inspecting a reticle, and forming a pattern on the wafer using the reticle prior to inspecting the wafer. Another computer-implemented method includes detecting defects ona wafer by analyzing data generated by inspecting the wafer in conjunction with data representative of a reticle, the data representative of the reticle including markers identifying different typesof portions of the reticle. Yet another computer-implemented method includes determining performance of a manufacturing process used to process a wafer based on defects that alter characteristics of devices formed on the wafer. Yet another computer-implemented method includes altering or simulating one or more characteristics of an integrated circuit design based on data generated by inspecting the wafer. 本申请涉及一种使用设计者意图数据检查