Transient collimation heat flow simulation system and method in vacuum thermal environment

The invention provides a transient collimation heat flow simulation system and method in a vacuum thermal environment. The system and method are used for solving the problem that an existing heat flowsimulation system cannot be applied to a large space structure thermally induced dynamic response te...

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Bibliographic Details
Main Authors FAN CHAO, WANG JING, SU XINMING, BI YANQIANG, LIN BOYING, LI XIYUAN, LIU GUOQING, SUN XUEYIN, HOU YAQIN
Format Patent
LanguageChinese
English
Published 25.12.2020
Subjects
AIRCRAFT
AVIATION
COSMONAUTICS
PERFORMING OPERATIONS
TRANSPORTING
VEHICLES OR EQUIPMENT THEREFOR
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Summary:The invention provides a transient collimation heat flow simulation system and method in a vacuum thermal environment. The system and method are used for solving the problem that an existing heat flowsimulation system cannot be applied to a large space structure thermally induced dynamic response test. The transient collimation heat flow simulation system in the vacuum thermal environment comprises an infrared lamp array and a movable baffle subsystem, wherein the infrared lamp array is formed by tightly arranging a plurality of infrared lamps provided with parabolic mirrors; the movable baffle subsystem is arranged between a light-emitting surface and an illuminated target; according to a non-imaging optical theory, a heat flow transmission path is optimized by utilizing the parabolic mirrors, the infrared lamps are arranged at focal points of the parabolic mirrors, a layer of gold foil is sprayed or sputtered on the surface of a paraboloid, and heat flow is reflected by the parabolic mirrors to obtain colli
Bibliography:Application Number: CN202011077928