Automatic semiconductor carrier plate taking device

The invention provides an automatic semiconductor carrier plate taking device. The automatic semiconductor carrier plate taking device comprises a first conveying module, a carrier plate machining module and a clamping module. The carrier plate machining module comprises a carrier plate assembly. Th...

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Bibliographic Details
Main Authors ZHAO NINGBO, CAO KUIKANG, SHE YI, CAI XIONGFEI, WEI XIAOYIN, KONG CHENHUI, XIE ZHIYIN
Format Patent
LanguageChinese
English
Published 22.12.2020
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Summary:The invention provides an automatic semiconductor carrier plate taking device. The automatic semiconductor carrier plate taking device comprises a first conveying module, a carrier plate machining module and a clamping module. The carrier plate machining module comprises a carrier plate assembly. The carrier plate assembly is provided with an upper-layer containing rail and a lower-layer containing rail which are used for containing carrier plates; the clamping module comprises a second base, a clamping assembly, a second driving assembly, a second sliding rail and a second sliding seat; the clamping assembly is fixedly connected with the second driving assembly, and the second driving assembly is fixedly connected with the second sliding seat; the second sliding seat is in sliding connection with the second sliding rail; and the clamping assembly moves in the direction of the second sliding rail under the driving force of the second driving assembly so as to load the carrier plates into the upper-layer conta
Bibliography:Application Number: CN202011193541