Automatic semiconductor carrier plate taking device
The invention provides an automatic semiconductor carrier plate taking device. The automatic semiconductor carrier plate taking device comprises a first conveying module, a carrier plate machining module and a clamping module. The carrier plate machining module comprises a carrier plate assembly. Th...
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Main Authors | , , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
22.12.2020
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Subjects | |
Online Access | Get full text |
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Summary: | The invention provides an automatic semiconductor carrier plate taking device. The automatic semiconductor carrier plate taking device comprises a first conveying module, a carrier plate machining module and a clamping module. The carrier plate machining module comprises a carrier plate assembly. The carrier plate assembly is provided with an upper-layer containing rail and a lower-layer containing rail which are used for containing carrier plates; the clamping module comprises a second base, a clamping assembly, a second driving assembly, a second sliding rail and a second sliding seat; the clamping assembly is fixedly connected with the second driving assembly, and the second driving assembly is fixedly connected with the second sliding seat; the second sliding seat is in sliding connection with the second sliding rail; and the clamping assembly moves in the direction of the second sliding rail under the driving force of the second driving assembly so as to load the carrier plates into the upper-layer conta |
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Bibliography: | Application Number: CN202011193541 |