Semiconductor test structure and formation method thereof, and test method of semiconductor device

• Main Authors: MU JINGJING, TIAN WENXING
• Format: Patent
• Language: Chinese; English
• Published: 18.12.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides a semiconductor test structure and a formation method thereof, and a test method of a semiconductor device. The semiconductor test structure comprises at least one semiconductordevice, at least two test ends and at least four unidirectional conduction structures, wherein the semiconductor device is formed on the substrate, one semiconductor device is connected with two testends, two one-way conduction structures are connected in parallel between one test end and one semiconductor device, and the conduction directions of the two one-way conduction structures are opposite. When the semiconductor testing structure provided by the invention is used for testing the semiconductor device, the abnormal position can be positioned, so failure analysis can be only carried outon the abnormal position, the situation that machine resources and human resources for failure analysis are wasted due to blind and comprehensive failure analysis is avoided, the efficiency is improved, and the cost is reduced