Method for testing microcosmic bonding strength and elasticity modulus of concrete interface transition area

• Main Authors: ZHANG RUIYU, JIANG NENGDONG, SONG ZHISHU, ZHUANG PEIZHI, ZHANG HONGZHI, WANG JIAMIN, WANG YULIANG, LIANG FENG, CHI CHAOMING, YUAN HUAQIANG, GE ZHI, HE HAIDONG, QIN JIN
• Format: Patent
• Language: Chinese; English
• Published: 15.12.2020
• Subjects: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; PHYSICS; TESTING

The invention relates to a method for testing microscopic bonding strength and elasticity modulus of a concrete interface transition area, and belongs to the field of civil engineering. The method comprises the following steps of: grinding, polishing and cutting a to-be-tested piece into cuboids, and then performing ultrasonic cleaning; testing the bonding strength of the interface transition areaof the to-be-tested piece, and fixing the to-be-tested piece on an objective table; positioning and calibrating a sample of the to-be-tested piece and a pressure head by adopting an in-situ imaging system; aligning the pressure head with a free end point of the to-be-tested piece; and applying a load to the free end point by using a nanoindentation technology until the free end point is damaged to obtain a micro-force displacement curve of a micro-cantilever in the interface transition area. The method can be used for directly testing the mechanical property of a set cement-aggregate interface transition area, a micr