Lead frame for plastic package type IPM

• Main Authors: CHEN JIEHUA, YIN JIPING, YIN JIE, ZHU HUAILIANG, ZHANG XIN
• Format: Patent
• Language: Chinese; English
• Published: 04.12.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides a lead frame for a plastic package type IPM, which relates to the technical field of integrated circuit leads and lead frames, and comprises a plurality of frame units. Each frame unit comprises a frame with a dual-rectangular structure, a first transverse rib and a second transverse rib which are parallel to each other are arranged in the frame, and a first base island anda second base island are arranged on one side, close to the second transverse rib, of the first transverse rib. A first outer lead and a second outer lead are connected between the first transverse rib and the frame, a first inner lead is connected to the side, close to the first base island, of the first transverse rib, a second inner lead is connected to the side, close to the second base island, of the first transverse rib, and connecting plates arranged at intervals are connected to the ends, close to the second base island, of half of the second inner leads. A third outer lead is connected between the second tran