Device, equipment and method for angle polishing of silicon wafer sample

• Main Author: JIN XUANZHU
• Format: Patent
• Language: Chinese; English
• Published: 04.12.2020
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; MEASURING; PERFORMING OPERATIONS; PHYSICS; POLISHING; TESTING; TRANSPORTING

The embodiment of the invention discloses a device, equipment and method for angle polishing of a silicon wafer sample. The device comprises a polishing plate which is used for polishing a polishing surface of the silicon wafer sample, and is driven to revolve around a revolution axis while rotating around a rotation axis, wherein the directions of the revolution and the rotation are opposite; anannular component is fixed to the polishing plate and a clamp arranged on the polishing face of the polishing plate and located in an annular area defined by the annular component, and the clamp is used for clamping the silicon wafer sample; and the revolution enables the clamp to be pressed against the annular component under the centrifugal action, and the rotation enables the annular componentto move relative to the clamp in the tangential direction of the clamp and provides tangential friction force for the clamp, so that the clamp is driven to rotate on the polishing surface of the polishing plate. 本发明实施例公开了一种用于角