CIRCUIT BOARD ASSEMBLIES

• Main Authors: LUIS COELHO MORAIS DE SERPA ROSA CESAR, CLOTET MARTI MARC, GOMEZ TRAVESSET XAVIER
• Format: Patent
• Language: Chinese; English
• Published: 01.12.2020
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

In an example there is provided a method for electromagnetically shielding a circuit board assembly. The method comprises depositing a solder material at multiple locations on a substrate, heating thesolder material according to a predetermined thermal profile and coupling an enclosure to the substrate at the locations to provide an electromagnetic shielding for components attached to the substrate. The locations are arranged on the substrate such that a size of a largest aperture of the circuit board assembly is below a pre-determined threshold size value. 在一示例中，提供有一种用于电磁屏蔽电路板组装件的方法。该方法包括在基板上的多个位置处沉积焊接材料，根据预定的热分布加热焊接材料，以及在所述位置处将外壳耦合到基板，以对于附接到基板的部件提供电磁屏蔽。所述位置被布置在基板上，使得电路板组装件的最大孔径的尺寸在预定的阈值尺寸值以下。