BONDED SUBSTRATE, ELASTIC SURFACE WAVE ELEMENT, ELASTIC SURFACE WAVE ELEMENT DEVICE, AND METHOD FOR MANUFACTURING BONDED SUBSTRATE

• Main Authors: MIZUNO JUN, KAKIO SHOJI, KAYANO RINZO, KISHIDA KAZUHITO, KURIMOTO KOUHEI
• Format: Patent
• Language: Chinese; English
• Published: 27.11.2020
• Subjects: AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUSPOLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR; BASIC ELECTRONIC CIRCUITRY; CHEMISTRY; CRYSTAL GROWTH; ELECTRICITY; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; METALLURGY; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE; REFINING BY ZONE-MELTING OF MATERIAL; RESONATORS; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE; SINGLE-CRYSTAL-GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL ORUNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL

A bonded substrate has a crystal substrate which is cut at an angle intersecting the crystal X axis, and a piezoelectric substrate laminated on the crystal substrate, wherein: the cut angle of the crystal substrate is preferably an angle within the range of 85-95 degrees of the crystal X axis; the elastic surface wave propagation direction of the crystal substrate preferably forms an angle of 15-50 degrees with the crystal Y-axis; lithium niobate or lithium tantalate is preferably used for the piezoelectric substrate; and the thickness h of the piezoelectric substrate is preferably a factor of0.02-0.11 of the wavelength [lambda] of the elastic surface wave. 本发明的接合基板具有以与晶体X轴交叉的角度被切割的水晶基板、和在所述水晶基板上进行层叠的压电基板，优选为水晶基板的切割角度相对于晶体X轴具有85～95度的范围的角度，优选为水晶基板的声表面波传播方向相对于晶体Y轴具有15～50度的角度，作为压电基板，优选为使用铌酸锂或钽酸锂，优选为压电基板具有厚度h相对于声表面波的波长λ具有0.02～0.11λ的关系。