Flexible circuit film bonding apparatus and method of bonding flexible circuit film by using same

• Main Authors: LEE JOONGMOK, LEE CHUNG-SEOK, JEON EUNJEONG
• Format: Patent
• Language: Chinese; English
• Published: 24.11.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The present invention provides a flexible circuit film bonding apparatus and a method of bonding a flexible circuit film by using the same. The flexible circuit film bonding apparatus includes a stageconfigured to support a TFT substrate; a pressing head configured to press and heat the flexible circuit film attached on the TFT substrate with an anisotropic conductive film interposed therebetween; a backup plate configured to support and heat the TFT substrate positioned below the flexible circuit film; and a heating control unit configured to control the temperature of a lower surface of thepressing head and an upper surface of the backup plate, wherein the temperature of the upper surface of the backup plate is less than 170 DEG C. 本申请提供了柔性电路膜粘接装置和利用其粘接柔性电路膜的方法。柔性电路膜粘接装置包括平台、挤压头部、垫板和加热控制单元，其中，平台配置成支承TFT衬底；挤压头部配置成挤压和加热柔性电路膜，该柔性电路膜利用插置于其间的各向异性导电膜附接在TFT衬底上；垫板配置成支承和加热位于柔性电路膜下方的TFT衬底；加热控制单元配置为控制挤压头部的下表面和垫板的上表面的温度，其中垫板的上表面的温度小于170摄氏度。