Air gap graphene field effect transistor structure and production method
The invention belongs to the technical field of integrated circuits, and discloses an air gap graphene field effect transistor structure. A graphene material is used as a channel, and an upper surfaceand a lower surface of the channel are both partially or completely contacted with air or vacuum. Th...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
20.11.2020
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Subjects | |
Online Access | Get full text |
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Summary: | The invention belongs to the technical field of integrated circuits, and discloses an air gap graphene field effect transistor structure. A graphene material is used as a channel, and an upper surfaceand a lower surface of the channel are both partially or completely contacted with air or vacuum. The graphene material is obtained by spin-coating a graphene oxide material at a channel position andthen performing high-temperature reduction. Air gaps are formed above and below the channel of the graphene material so as to form suspended channels, therefore, a problem that carrier mobility of the graphene channel is greatly reduced due to contact between the graphene channel and other materials is solved; and the high mobility of carriers in graphene is reserved to the maximum extent, degradation of graphene surface characteristics is reduced, electrical characteristics of a graphene device are improved, graphene oxide is spin-coated to the channel position, then high-temperature reduction is performed to obtain |
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Bibliography: | Application Number: CN202010705457 |