Air gap graphene field effect transistor structure and production method

The invention belongs to the technical field of integrated circuits, and discloses an air gap graphene field effect transistor structure. A graphene material is used as a channel, and an upper surfaceand a lower surface of the channel are both partially or completely contacted with air or vacuum. Th...

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Bibliographic Details
Main Authors KANG XIAOXU, CHEN SHOUMIAN, SHEN RUOXI, ZHONG XIAOLAN
Format Patent
LanguageChinese
English
Published 20.11.2020
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Summary:The invention belongs to the technical field of integrated circuits, and discloses an air gap graphene field effect transistor structure. A graphene material is used as a channel, and an upper surfaceand a lower surface of the channel are both partially or completely contacted with air or vacuum. The graphene material is obtained by spin-coating a graphene oxide material at a channel position andthen performing high-temperature reduction. Air gaps are formed above and below the channel of the graphene material so as to form suspended channels, therefore, a problem that carrier mobility of the graphene channel is greatly reduced due to contact between the graphene channel and other materials is solved; and the high mobility of carriers in graphene is reserved to the maximum extent, degradation of graphene surface characteristics is reduced, electrical characteristics of a graphene device are improved, graphene oxide is spin-coated to the channel position, then high-temperature reduction is performed to obtain
Bibliography:Application Number: CN202010705457