Method for removing die box cavity residue in plastic package die

• Main Authors: CHEN ZHONGZHOU, FANG ZHAOGUO
• Format: Patent
• Language: Chinese; English
• Published: 13.11.2020
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

The invention provides a method for removing a die box cavity residue in a plastic package die. The method comprises the following steps: step 1, firstly, heating a die box cavity in the plastic package die, thereby decomposing, softening and coking the residue, and boating a coked residue; step 2, cleaning the coked residue, and completing removal of the die box cavity residue in the plastic package die. The method provided by the invention is not involved with chemical reagent treatment technologies, such as stripping, electroplating and corrosion, and is highly superior to conventional diedepot repair on the aspects of resource saving and environment protection; compared with the chemical reagent treatment technologies, the method is more mild, has no corrosion influence of chemical reagents, has relatively lower influence on the die and a plating layer, and has no influence on health of operators; and compared with a mechanical polishing technology, the residue attached is cleanedby a high temperature and