Low-temperature curing conductive adhesive and preparation method and application thereof

• Main Authors: KE MINGXIN, ZHANG CHUANYONG, KE SONG
• Format: Patent
• Language: Chinese; English
• Published: 10.11.2020
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; USE OF MATERIALS AS ADHESIVES

The invention discloses a low-temperature curing conductive adhesive and a preparation method and application thereof. The low-temperature curing conductive adhesive is prepared from the following rawmaterials: 3wt%-10wt% of alicyclic epoxy resin, 2wt%-4wt% of epoxy diluent, 1wt%-2wt% of oxetane, 1wt%-2wt% of cationic thermal initiator, 1wt%-2wt% of coupling agent, 80wt%-90wt% of silver powder, 0.4 wt%-0.7 wt% of silver powder surface treating agent and 0.03 wt%-0.1 wt% of defoaming agent; wherein the sum of the total mass percentages of the raw materials is 100%. The invention also providesa preparation method of the low-temperature curing conductive adhesive, and the low-temperature curing conductive adhesive can realize low-temperature (80 DEG C) short-time curing and can resist hightemperature (85 DEG C) and high humidity (85% RH). 一种低温固化导电胶及其制备方法和应用。该低温固化导电胶的原料组成为：3wt％-10wt％的脂环族环氧树脂、2wt％-4wt％的环氧稀释剂、1wt％-2wt％的氧杂环丁烷、1wt％-2wt％的阳离子热引发剂、1wt％-2wt％的偶联剂、80wt％-90wt％的银粉、0.4wt％-0.7wt％的银粉表面处理剂、0.03wt％-0.1wt％的消泡剂，各原料