Phthalic anhydride diisopropanolamide epoxy resin as well as preparation method and application thereof

• Main Authors: ZHU XINBAO, YU MIN, HAN XUE, ZHANG XIAOXIANG, FU QINGHE, CHEN MUHUA, CHENG ZHENSHUO, ZHANG TONGTONG, LI DAQIAN
• Format: Patent
• Language: Chinese; English
• Published: 10.11.2020
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; HETEROCYCLIC COMPOUNDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC CHEMISTRY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP

The invention provides phthalic anhydride diisopropanolamide epoxy resin as well as a preparation method and application thereof, belongs to the technical field of organic synthesis, and mainly comprises phthalic anhydride diisopropanolamide polyglycidyl ether, and the mass percentage content of the phthalic anhydride diisopropanolamide polyglycidyl ether in the phthalic anhydride diisopropanolamide epoxy resin is greater than or equal to 70%. The epoxy value of the phthalic anhydride diisopropanolamide epoxy resin provided by the invention is 0.42-0.49 eq/100g, and the phthalic anhydride diisopropanolamide epoxy resin has relatively low viscosity, so that the rigidity, the toughness and the high temperature resistance of an E-51 epoxy resin cured product can be enhanced. The invention also provides a preparation method of the epoxy resin in the technical scheme, the epoxidation degree of the raw materials is ensured by controlling the reaction temperature, time and proportion, so thatthe final epoxy resin ha