HIGH TEMPERATURE RESISTANT MASKING ADHESIVE COMPOSITION

• Main Authors: GRISLE ROGER A, SIM YI LIN, MARTIN MICHAEL C, ONG CHIN TEONG, LEHN NATHANIEL I, LIU RICHARD YUFENG
• Format: Patent
• Language: Chinese; English
• Published: 06.11.2020
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES

Hot melt processable adhesive compositions to mask electronic components include at least one block copolymer, at least one tackifying resin, at least one semi-crystalline polyolefin polymer, at leastone plasticizer, and at least one anti-oxidant. The adhesive composition is a hot melt processable pressure sensitive adhesive composition that is thermally stable, such that the composition when disposed on a surface withstands heating to 260 DEG C without degradation or flowing, remains optically transparent, and after heating to 260 DEG C remains cleanly removable. 本发明提供了用于掩蔽电子部件的可热熔融加工的粘合剂组合物，其包含至少一种嵌段共聚物、至少一种增粘树脂、至少一种半结晶聚烯烃聚合物、至少一种增塑剂和至少一种抗氧化剂。该粘合剂组合物为热稳定的可热熔加工的压敏粘合剂组合物，使得当该组合物设置于表面上时，即使经受加热至260℃也不降解或流动，而保持光学透明，并且在加热至260℃后保持可干净地移除。