Silicon-based air-filled micro-coaxial structure and silicon-based air-filled micro-coaxial transmission line

• Main Authors: YANG ZHI, WANG SHENGFU, SHI JINGJING, LI FENG, LIANG JINGTING, ZHOU MINGQI, CHEN XUDONG, DONG CHUNHUI, QIAN LIXUN, WANG WENJUN, LI HONGJUN, ZHOU SHAOBO, SHEN XIAOFANG, FU XINGZHONG, WANG JIANZHI
• Format: Patent
• Language: Chinese; English
• Published: 06.11.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE; SEMICONDUCTOR DEVICES; WAVEGUIDES

The invention is applicable to the technical field of radio frequency microwaves, and provides a silicon-based air-filled micro-coaxial structure and a silicon-based air-filled micro-coaxial transmission line. The silicon-based air-filled micro-coaxial structure comprises an upper-layer silicon wafer, a middle-layer silicon wafer and a lower-layer silicon wafer; the upper-layer silicon wafer is provided with a first groove; the core silicon wafer of the middle-layer silicon wafer corresponds to the first groove in position; the plurality of left support beam silicon wafers of the middle-layersilicon wafer are arranged between the first silicon wafer and the core silicon wafer of the middle-layer silicon wafer; a plurality of right support beam silicon wafers of the middle-layer silicon wafer are arranged between the core silicon wafer and the second silicon wafer of the middle-layer silicon wafer; the first silicon wafer and the second silicon wafer are respectively provided with a first through hole array pe