Chip-level micro-packaged band-pass filter and packaging method thereof

• Main Authors: WANG LIFENG, AI SHANSHAN
• Format: Patent
• Language: Chinese; English
• Published: 03.11.2020
• Subjects: BASIC ELECTRONIC CIRCUITRY; ELECTRICITY; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS

The invention relates to a chip-scale miniature packaged band-pass filter and a packaging method. The device comprises a packaging shell and a PCB 30 arranged in the packaging shell; the chip-scale miniature packaged band-pass filter is characterized in that the packaging shell is composed of a base...