Chip-level micro-packaged band-pass filter and packaging method thereof

• Main Authors: WANG LIFENG, AI SHANSHAN
• Format: Patent
• Language: Chinese; English
• Published: 03.11.2020
• Subjects: BASIC ELECTRONIC CIRCUITRY; ELECTRICITY; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS

The invention relates to a chip-scale miniature packaged band-pass filter and a packaging method. The device comprises a packaging shell and a PCB 30 arranged in the packaging shell; the chip-scale miniature packaged band-pass filter is characterized in that the packaging shell is composed of a base (20), outer pins of the base and an upper cover (40); the upper cover (40) covers the base (20), and the PCB (30) is bonded on the base (20); the circuit terminal post Port1 and the circuit terminal post Port2 are respectively arranged on two sides of the surface of the PCB. The band-pass filter issmall in size, low in insertion loss and high in rectangularity, the bandwidth reaches 12 MHz at the frequency point of 21.4 MHz, and the electrical performance index of the filter is greatly improved. 一种芯片级微型封装的带通滤波器及封装方法，其装置包括封装外壳及设于封装外壳中的PCB板30，其特征在于，所述封装外壳由底座(20)、底座的外引脚及上盖(40)构成，所述上盖覆盖(40)在底座(20)上，所述PCB板(30粘结在底座(20)上，所述PCB板表面设有电路端柱Port1和电路端柱Port2，电路端柱Port1和电路端柱Port2分别在PCB板表面两边；本发明实现了带通滤波器体积小、低插损、高矩形度的目的，在21.4MHz频率点下带