ELECTROSTATIC CHUCK AND WAFER PROCESSING APPARATUS

• Main Authors: YOSHII YUICHI, ANADA KAZUTERU
• Format: Patent
• Language: Chinese; English
• Published: 03.11.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

An electrostatic chuck includes a ceramic dielectric substrate having a first major surface on which an object to be processed is mounted, and a second major surface, the ceramic dielectric substratebeing a polycrystalline ceramic sintered body, an electrode layer provided on the ceramic dielectric substrate, a base plate provided on a side of the second major surface and supporting the ceramic dielectric substrate, and a heater provided between the electrode layer and the base plate. The base plate includes a through hole piercing the base plate and a communication path passing a medium adjusting a temperature of the object to be processed, and when viewed in a direction perpendicular to the first major surface, at least a part of the heater exists on a side of the through hole as viewedfrom a first portion of the communication path which is closest to the through hole. 本发明提供一种静电吸盘，具备：多结晶陶瓷烧结体即陶瓷电介体基板，具有放置处理对象物的第1主面与第1主面相反侧的第2主面；电极层，设置于陶瓷电介体基板；基座板，设置在第2主面侧而支撑陶瓷电介体基板；及加热器，设置在电极层与基座板之间，其特征为，基座板具有：通孔，贯通基座板；及连通路