FRICTION BONDING DEVICE AND METHOD OF OPERATING SAME

• Main Authors: OHASHI RYOJI, MURAMATSU YOSHITAKA, TAKEOKA NAOKI, FUKUDA TAKUYA
• Format: Patent
• Language: Chinese; English
• Published: 30.10.2020
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

A friction bonding device provided with a tool (10), a rotational driver (8), a direct-acting driver (7), and a control device (30) which is configured to perform: (A) controlling the direct-acting driver (7) and the rotational driver (8) so that, by causing a tip portion of the tool (10) to rotate while being pressed against a portion (Wa) to be bonded of an object to be bonded (W), the temperature of the portion (Wa) to be bonded becomes an A1 transformation point or higher; (B) causing the tip portion of the tool (10) to reach a first position so that a second member (W2) that has softenedpierces a first member (W1) that has softened; and (C) controlling the direct-acting driver (7) and the rotational driver (8) so that the tool (10) is pulled off the portion (Wa) to be bonded in a state of being rotated. 本发明的摩擦接合装置具备：工具(10)；旋转驱动器(8)；直动驱动器(7)；以及控制装置(30)，上述控制装置构成为执行：步骤A，控制直动驱动器(7)以及旋转驱动器(8)，以使工具(10)的末端部一边按压被接合物(W)的被接合部(Wa)一边旋转，而使被接合部(Wa)的温度成为A1相变点以上；步骤B，使工具(10)的末端部到达第一位置，以使软化的第二部件(W2)刺入软化的第一部件(W1)；以及步骤C，控制直